Bonding agents

• Low pH (1.5) provides effective and consistent bonding.
• Use in all total-etch, self-etch and selective etch bonding techniques.
• Low film thickness (3 microns) enables use with resin cements to bond indirect restorations.
• Universal (8th generation) bonding agent for use in direct and indirect procedures and treatment of hypersensitivity.
• Up to 5 minutes working time.
• Consistent bond strength with easy application.

• Multi-Purpose Primer is one part of our light cure dental adhesive system that is fast and easy to apply, and offers excellent bond strengths to a variety of surfaces. 

• Store at room temperature (1-28°C) (33.8-82.4°F)

PRECAUTION

• SOLARE UNIVERSAL BOND is flammable. Do not use near open flame. Keep away from sources of ignition. Do not store large quantities in one area. Keep away from direct sunlight.
• SOLARE UNIVERSAL BOND is volatile. Use in a well ventilated place. Advise patients to breath through nose.
• In case of contact with eyes, flush immediately with water and seek medical attention.
• In case of contact with oral tissue or skin, immediately remove with a sponge or cotton pellet. After the restorative treatment is finished, rinse thoroughly with water.
• If the tissue contacted by the material turns white or forms a blister, advise the patient to leave the affected area undisturbed, until the mark disappears, usually in 1-2 weeks. To avoid contact, it is recommended to apply cocoa butter to the area where rubber dam cannot cover.
• Avoid inhalation or digestion of material.
• When spilt on the table or floor, immediately wipe off with a dry cloth.
• Do not mix with other products.
• Dispose of all waste according to local regulations.
• In rare cases the product may cause sensitivity in some people. If any such reactions are experienced, discontinue the use of the product and refer to a physician.
• Personal protective equipment (PPE) such as gloves, face mask

• Go beyond versatile. Discover the universal bonding solution with Single Bond Universal Adhesive
• Combined Total-Etch, Self-Etch and Selective-Etch adhesive.

• Excellent bond strength to tooth structure (enamel and dentin), metal, porcelain and dental resins.
• Universal dental applications.
• Pulpal safety.
• Formulation of a hybrid layer (resin impregnated layer) in both enamel and dentin. This layer reinforces the tooth surface against recurrent caries and prevents the post-operative hypersensitivity.
• Super-Bond C&B Quick Monomer is a monomer with curing time faster than Super-Bond C&B Monomer.

• Pre activated. 
• solvent based on ethanol. 
• Better adhesion.
• Esasy to use. 
• Less evaporation. 
• Enhances bonding of resin materials (resin and cements) to porcelain (ceramic) and glass fiber.

• CLEARFIL SE BOND is a simplified, light-cure bonding system containing a water-based primer.

• Direct-placed light-curing composite and compomer restorations.
• Direct-placed core build-ups with light-, self- and dual-curing composites.
• Repair of fractured composite and compomer restorations.
• Adhesive cementation of indirect restorations with light- and dual-curing luting composites.
• Sealing of prepared tooth surfaces before temporary/permanent cementation of indirect resto-rations.
• Desensitization of hypersensitive cervical areas.

• High bond strength.
• Reduced technique sensitivity.
• Reliable and consistent results.

• Unprepared enamel
• Sclerotic dentine
• Large enamel areas
• Ceramic fracture repairs
• Cavities with low retention
• Post cementation

• Adhesion of the composite resin for direct restoration.
• Simple to use one step bonding material.
• Excellent adhesion to dentin and enamel.
• Long lasting bonding strength.

• Go beyond versatile. Discover the universal bonding solution with Single Bond Universal Adhesive
• Combined Total-Etch, Self-Etch and Selective-Etch adhesive.

Excellent Bond Strength and great sealing ability

Bondfill DUAL uses TBB resin technology as bondfill SB (self cure, self adhesive resin). TBB in catalyst initiates polymerization at the ttoth surface , which results in outstanding bonding with minimum contraction gap

Significant Resiliency

Produces a strong yet resilient resin that has been designed to absorb intense and complicated external stress.

Simple steps for Solid Performance

Moderate wear resistance

Easy on opposing teeth but greatly resists wear

• Te-Econom Bond is a single-component bonding agent for enamel and dentin bonding in conjunction with the total-etch technique.
• One-bottle, one-layer adhesive.
• High bond strengths.
• Minimal evaporation of solvent (alcohol).
• Direct light-curing restorations.

      - PALFIQUE Bond has better operability, with the same high bond strength as the original TOKUYAMA BOND FORCE